Cleanroom
Coming soon
SUSS Bonding System
The SUSS Bonding System supports controlled bonding workflows for compatible cleanroom substrates and processes.
Details
Use this tool for approved bonding processes where substrate materials, surface preparation, alignment, pressure, and temperature requirements have been reviewed.
Typical uses
- Bond compatible wafers or substrates
- Support multilayer device fabrication
- Develop controlled assembly workflows
Access notes
Cleanroom access, process approval, and tool-specific training are required before use.
This tool is coming soon and is not yet available for routine booking.
Cleanroom tools may require intake, orientation, training, approved process details, and booking through NEMO before use.